2N2219
2N2219A
SILICON
NPN TRANSISTORS
w w w. c e n t r a l s e m i . c o m
DESCRIPTION:
The CENTRAL SEMICONDUCTOR 2N2219 and
2N2219A are silicon NPN transistors manufactured by
the epitaxial planar process, and designed for small
signal general purpose and switching applications.
MARKING: FULL PART NUMBER
TO-39 CASE
MAXIMUM RATINGS: (TA=25°C unless otherwise noted)
SYMBOL
Collector-Base Voltage
VCBO
Collector-Emitter Voltage
VCEO
Emitter-Base Voltage
Continuous Collector Current
Power Dissipation
Power Dissipation (TC=25°C)
Operating and Storage Junction Temperature
2N2219
60
2N2219A
75
UNITS
V
30
40
V
VEBO
IC
5.0
PD
PD
TJ, Tstg
V
mA
800
mW
3.0
W
-65 to +200
°C
ELECTRICAL
SYMBOL
ICBO
ICBO
CHARACTERISTICS: (TA=25°C)
TEST CONDITIONS
VCB=50V
VCB=60V
ICEV
IEBO
VCE=60V, VEB=3.0V
VEB=3.0V
BVCBO
IC=10μA
BVCEO
IC=10mA
30
-
40
-
V
BVEBO
IE=10μA
5.0
-
6.0
-
V
VCE(SAT)
IC=150mA, IB=15mA
IC=500mA, IB=50mA
-
0.4
-
0.3
V
-
1.6
-
1.0
V
VCE(SAT)
VBE(SAT)
VBE(SAT)
hFE
hFE
hFE
hFE
hFE
IC=150mA, IB=15mA
IC=500mA, IB=50mA
VCE=10V, IC=100μA
VCE=10V, IC=1.0mA
VCE=10V, IC=10mA
VCE=10V, IC=150mA
2N2219
MIN
MAX
10
6.0
800
2N2219A
MIN
MAX
-
UNITS
nA
-
-
-
10
nA
-
-
-
10
nA
-
10
-
10
nA
60
-
75
-
V
-
1.3
-
1.2
V
-
2.6
-
2.0
V
35
-
35
-
50
-
50
-
75
-
75
-
100
300
100
300
VCE=1.0V, IC=150mA
VCE=10V, IC=500mA
50
-
50
-
hFE
30
-
-
-
hFE
VCE=10V, IC=500mA
-
-
40
-
R1 (31-July 2013)
2N2219
2N2219A
SILICON
NPN TRANSISTORS
ELECTRICAL
SYMBOL
fT
Cob
ton
toff
CHARACTERISTICS - Continued: (TA=25°C)
2N2219
TEST CONDITIONS
MIN
MAX
VCE=20V, IC=20mA
250
VCB=10V, f=100kHz
VCC=30V, IC=150mA, IB=15mA
VCC=30V, IC=150mA, IB1=IB2=15mA
2N2219A
MIN
MAX
300
-
UNITS
MHz
-
8.0
-
8.0
pF
-
35
-
35
ns
-
285
-
285
ns
TO-39 CASE - MECHANICAL OUTLINE
LEAD CODE:
1) Emitter
2) Base
3) Collector
MARKING: FULL PART NUMBER
R1 (31-July 2013)
w w w. c e n t r a l s e m i . c o m
2N2219
2N2219A
SILICON
NPN TRANSISTORS
TYPICAL ELECTRICAL CHARACTERISTICS
R1 (31-July 2013)
w w w. c e n t r a l s e m i . c o m
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
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